1 layer, 1.6mm

Gold plating: 2-3um

Au: 1-1.9u''

Ni: 5um(min)

Complex outline

Available surface finish _ Flash Gold / Hard Gold Plating / Immersion Nickel / Gold / Silver/ Tin
Hot Air Solder Leveling / HAL Lead-Free / Selective Plating / Entek Coating (OSP) / Milling Process / V-Cut Process / Gold Finger Process / Peelable Mask / Carbon Ink Printing

Engineering capability

Positioning         + / - mm  + / - inches
1. Hole or center position tolerance        0.050  0.002
2. Pattern registration with outline        0.076  0.003
3. Punching shift with outline         0.150  0.006
4. Min. Clearance between Holes and outline    Equal to Board Thickness

Hole size Tolerance          + / - mm  + / - inches
1. Minimum Finished Hole size    0.300  0.014
2. Maximum drill size        6.500  0.256
3. Maximum Aspect Ratio      4
4. Hole size tolerance    (PTH)  0.075  0.003
    (NPTH)  0.050  0.002
5. Drill hole to drill hole pitch tolerance (t < 0.6 mm)        0.075  0.003

Outline Tolerance          + / - mm  + / - inches
1. Punched Outline Dimension        0.150  0.006
2. Routed outline Dimension        0.130  0.005

Plating Tolerance
1. Minimum PTH thickness        3 um
2. Minimum Gold thickness        0.03 um
3. Minimum Nickel thickness      3 um
4. Max. Cu thk.        28 um
5. Max. Ni thk.        10 um
6. Max. Au thk.        3 um
7. Hot Air solder levelling    2 - 38 um

Solder Mask          + / - mm  + / - inches
1. Minimum Opening      0.10  0.005
2. Minimum trace        0.08
3. Min. Trace between pads    0.20
4. Registration tolerance    0.10
5. Mask thickness on     bare base material    0.7 to 1.2 mil
    pads     0.6 to 1.0 mil
    traces     0.2 to 0.5 mil

V - Cutting (scoring)
Board shape must have at least 2 parallel lines for V-score!
1. Min. Remaining thickness      for FR4  0.3+/-0.1
    for CEM3  or CEM 1  0.5+/-0.1

Inner Layers          + / - mm  + / - inches
1. Min. Annualar ring      0.01  0.0005
2. Min. Line width        0.12  0.0050
3. Min. Spacing        0.13  0.0050
4. Registration tolerance    +/-0.13  +/-. 005

CMOS Cavity Requirements
1. Remain thk. Of the Cavity  +/- 0.05
2. Dimension of Cavity    +/- 0.15
3. Location of Cavity      +/- 0.15

Panel Size
Maximum Panel Size      18 " X 24"
Maximum Circuit Size      17" X 22"
        + / - mm  + / - inches
2. Location tolerance        +/-0.2
3. Maximum board size for V-cut  15.25"
4. Min. Board size for V-cut      4"
5. Min. Thk. Requirement for V-cut  0.6 mm
6. Angle available to choose    30 and 45 degree
7. V-cut to outline tolerance      +/- 0.15

Chamfering
1. Tolerance        +/-0.15mm
2. Angles in bevelling    45 & 60

Angular tolerance
For board thk. = or < 0.6mm's outline  +/- 0.5 degree