Mobile Phone Main Board (High Density Inverter PCB)
Specification: 8L(1+6+1)
Material: FR-4
Board thickness: 1.0mm
Final copper: 18um
Solder mask color: Green
Silkscreen: White(top)
Surface Finish: Immersion Gold + OSP(e. g. Entek)
Profile: Routing and stamp holes
E-test: 100% Fixture
Quality report: Solderability test, Final inspection and Microsection
| Model: | ROHS compliant |
|---|---|
| Standard: | IPC-6012 Class 2, SGS, ISO9001, UL approved |
| Productivity: | 1000,000pcs/month |
| Trademark: | HX |
Mobile Phone Main Board (High Density Inverter PCB) product offered by Hongkong Wah Shun Electronic Technology Limited
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