Fr4 SMT Electronic PCB Assembly

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Manufacturing Capacity

24 hours turn time on double sides PCBs,2-4 days for multilayer PCBs.
Current products manufactured include backplanes, hybrid boards,HDI boards,High TG boards, High Frequency boards, Halogen Free boards, Flex and Rigid Flex boards and more.
Toptechpcb has purchased advanced PCB manufacturing equipments, inspection equipments and software from the United States, Japan, Israel, Germany, Italy and Taiwan.
 

Production Capabilities

Layers count: 2- 40
Min Line width/spacing(mil): 2.5/2.5
Max Aspect Ratio: 22:1
Board thickness: 0.13-7.0mm 
Max Panel size: 23"x35"
Material: FR-4,High Tg FR-4,Halogen free,High Frequency
(Rogers,Arlon,Taconic,Nelco...)etc.
Surface Treatment: HASL,ENIG,ENEPIG,Immersion Silver,Immersion Tin,Flash Gold,Golden Finger,OSP,Lead free HASL etc.
 

Rigid-Flex Board

Mass production capacity for high density rigid-flex board fabrication
Max layers count: 20
Min Line width/spacing for inner layer(mil): 3.5/3.5
Max Aspect Ratio: 10:1
Min Hole size(mil): 8
Max panel size: 20*24 inch
Impedance control
HDI

Production Capabilities

Max PCB size: 510 x 460 mm
Min PCB size: 50x50mm
Board thickness: 0.4-5 mm
Components size: 0201-150mm
Component max height: 25mm
Min lead pitch: 0.3mm    
Min BGA ball pitch: 0.4mm
Placement precision: +/- 0.03mm
Laser cut for Stencil manufacture for manual, semi-automatic 
and full automatic solder print machine, the accuracy can be 5 um.