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Double-Sided PCB Board for Socket, Consumer Electronics

Specification:Material:FR4value:tg135board thickness:1.6mmcopper thickness:1ozSurface treatment:HASLApplication:consumer elctronicsOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplierKingboard,Shengyi,Nanya,ITEQ,Rogers,Totking, Ve

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Double-Sided Fr4 PCB with Immersion Gold Chemical Gold

Specification:Material:FR4value:tg135board thickness:1.6mmcopper thickness:1ozSurface treatment:imersion AgApplication:consumer elctronicsWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material

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Multilayer Printed Circuit Board PCB with 3/3mil Line

Specification:Material:FR4value:tg135board thickness:1.6mmcopper thickness:1ozSurface treatment:ENIGApplication:Consumer electronicsOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplierKingboard,Shengyi,Nanya,ITEQ,Rogers,Totking, V

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Multilayer PCB with Red Mask Small BGA and Immersion Gold

Specification:Material:FR4 6-layervalue:tg150board thickness:1.6mmcopper thickness:1ozSurface treatment:ENIGApplication:Consumer electronicsWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Materi

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4L Rigid PCB Board with Imersion Gold Treatment

Specification:Material:FR4value:tg150board thickness:1.6mmcopper thickness:1ozSurface treatment:ENIGApplication:Consumer electronicsOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplierKingboard,Shengyi,Nanya,ITEQ,Rogers,Totking, V

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PCB with Edge Plating Half Hole Small BGA and Enig

1. Specification:Layer:4LMaterial:FR4value:tg150board thickness:1.6mmcopper thickness:1ozSurface treatment: ENIGMinumum BGA size:0.25mmApplication:electronics products2. Our main process capability:Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5.0mm0.2-7.0mmM

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Double Side Imersion AG PCB Circuit for Telecom Products

Specification:Material:FR4value:tg135board thickness:1.6mmcopper thickness:1ozSurface treatment: imersion goldApplication:Telecom productsOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplierKingboard,Shengyi,Nanya,ITEQ,Rogers,Totk

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Red Oil PCB Board with 2 Oz for Electronic Board

Specification:Material:FR4value:tg135board thickness:1.6mmcopper thickness: 2 ozSurface treatment:HASL lead free Red solder maskApplication:Electronic productsOur main process capability:Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5.0mm0.2-7.0mmMax. Panel S

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Double-Side Rigid Lead-Free HASL PCB Circuit Board for Electronics

Specification:Material:FR4value:tg135board thickness:1.6mmcopper thickness:1ozSurface treatmentHASLApplication:TVOur main process capability:Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5.0mm0.2-7.0mmMax. Panel Size520X660mm680X1200mmMin. Mechnical Drill0.2m

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2layer Good Price 1.2mm Imersion Gold PCB Prototype

Specification:Material:FR4value:tg135board thickness:1.2mmcopper thickness:1ozSurface treatment:ENIGApplication:consumer electronicsOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplierKingboard,Shengyi,Nanya,ITEQ,Rogers,Totking, V

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4layer PCB Circuit Board with Gold Plated Gold Finger

1. Specification:Layer:4LMaterial:FR4value:tg150board thickness:1.6mmcopper thickness:1ozSurface treatment:ENIG+gold platedApplication:electronics products2. Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5.0mm0.2-7.0mmMax. Panel Size520X660mm680X1200mmMin. Me

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Green Soldermask PCB Circuit Board with 1.2mm 2 Layer

Specification:Layer 2MaterialFR4-TG150Board Thickness1.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingLF-HALMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpeci

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Gold Plating PCB 2 Layer with Penalization 30 up

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingENIGMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial

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Lead Free Hal 2 Layer PCB Circuit with Min Pads

1.Specification:Layer2Materialfr4 tg150Board Thickness1.6mmCopper Thickness1ozSoldermaskgreenSilkscreenwhiteSurface Finishinglead free halMin Line Width/Space8/8milMin Hole Size10mil2.Capability:Layer Count1 to 22 layerMaterial TypeFR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers.etc.Board Thic

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Isola PCB Bare Board with 3 Oz Copper

Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material:ROGERS, Arlon, Taconic.etc.Client:SAMSUNG, Skyworth, Malata, Midea.etc.Capability & Lead Time:Certificates(UL:E246887, TS16949, ISO14001,

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Customized Multilayer PCB with BGA for Consumer Electronics

1.Specification:Layer4Materialfr4 tg170Board Thickness1.6mmCopper Thickness2ozSoldermaskgreenSilkscreenwhiteSurface Finishinglead free halMin Line Width/Space4/4milMin Hole Size8 mil2.Capability:Layer Count1 to 22 layerMaterial TypeFR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers.etc.Board Thic

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Blue Oil PCB with Half Hole and Edge-Plating for Bluetooth

Specification:Material:FR4value:tg150board thickness:1.6mmcopper thickness:1ozSurface treatment:HASL lead freeOur main process capability:Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5.0mm0.2-7.0mmMax. Panel Size520X660mm680X1200mmMin. Mechnical Drill0.2mm0.

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4 Layer PCB Circuit Board with Carbon Oil

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLF-HALMin Hole Size 0.2mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpeci

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2 Layer Printed Circuit Board/PCB for Amplifier Circuit PCB

Specification:Layer 2MaterialFR4-TG150Board Thickness1.6mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingOSPMin Hole Size 0.25mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial

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Double-Sided 2.0mm Board Thickness Back Panel PCB

Specification:Material:FR4value:tg135board thickness:3.0mmcopper thickness:1ozSurface treatment:ENIGApplication:consumer electronicsOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplierKingboard,Shengyi,Nanya,ITEQ,Rogers,Totking, V

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