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Custom Polyimide Flex Rigid PCB - 1 with Tin Immersion and Gold Flash 12.5 - 200 Microns (FEI290)

Basic materials: Polyimide Thickness: 12.5 - 200 microns Surface finish: Tin immersion and Gold Flash

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Custom High Tg, Rogers Rigid - Flex PCB Circuit Board Assembly 1 - 30 Layer (FEI283)

Hole copper: 35um Surface treatment: Immersion gold Width/Length: 0.076/0.076mm(3/3mil) Core copper: 1OZ Remark: Rigid-flex board Sell all type of PCBs, Please free free to email us, Providing PCB production(1-30 Layer): >>Finished board thickness: 0.2-6.0mm; >>Copper thickness: 1/3-5OZ; >>Mate

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OEM Polyimide Flex Rigid PCB - 3 Circuit Board 2 Layer 1.6mm Thickness Assembly (FEI289)

Flex PCB 2 layer board Board thickness: 0.15mm Material: Polyimide Flex PCB Wonderful PCB Ltd. is specialized in 2 layer board Board thickness: 1.6mm Material: Polyimide

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OEM Immersion Gold L1 - L7 4 Layer PCB Printed Circuit Board Assembly 0.15 / 0.15mm (FEI284)

Layer immersion gold PCB with 3 years Manufacturiing experience 4 Layer PCB 4 Layer PCB for mobile product, professional manufacturer in China Materials: 1oz Board Thickness: 2.0mm Surface processing: Immersion gold Laser drill hole(minimum): 0.2mm Buried and blind via structure: L1-L2, L2-L

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4 Layer Golden Finger Fr - 4 PCB with Red Lpi Solder Mask Impedance Control, BGA Design (FEI283)

1. 4 layers FR-4 PCB 2. Copper thickness 1/1/1/1 3. Red LPI solder mask 4. Impedance control, BGA design 5. Golden finger

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OEM Cem - 1, Cem - 3 Material PCB Board Assembly 4 Layer with Osp, Gold Plating Surface (FEI282)

1, ISO90001: 2000, UL, SGS 2, No MOQ 3, One-stop-service 4, good quality with good price.

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OEM Rigid HASL Immersion Tin Six 6 Layer PCB with 1.6mm Board Thickness / 0.3mm Diameter (FEI279)

Rigid 6 layer PCB: Ayer count: 6 Board thickness: 1.6mm Minimum drill diameter: 0.3mm Aspect ratio: 5.0: 1, Line/space: 4/4 mil

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1oz Copper Thickness Fr4 Green Color 6 Layer PCB Assembly with Gold Finger and BGA Design (FEI278)

One stop service for 6 layer PCB manufacture, components purchasing, test, packing, high quality, and fast delivery time 6 layer PCB with gold finger and BGA 1. Material: FR4 PCB 2. Solder mask color: Green 3. Copper thickness: 1oz 4. Board thickness: 1.6mm 5. Surface finished: Lead free HASL

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OEM 3mil Rigid Flexible 6, 24, 30 Layer PCB with Teflon, Metal Substrate Material Service (FEI276)

6 layers PCB with FR-4 material Thickness: 1.6mm Finish coatting: LF Hot Air Level plus Golden Finger Copper size: 1oz

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RoHS ODM / OEM 2 Layer Electronic Circuit Boards PCB or PCBA Assembly Design (FEI286)

1. Electronic circuit PCB design 2. Approval ISO9001/ISO14001 3. RoHS, lead free 4. ODM/OEM are welcome 5. Fast lead time Electronic circuit PCB hot offer Printed circuit board, PCB board, circuit board, electronic circuit, PCB layout, PCB design, rigid PCB, clone PCB, mcpcb, circuit layout, elect

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Custom Immersion Gold Multilayer 6 Layer PCB Printed Circuit Board Assembly for Mobile (FEI276)

1: 6 Layer PCB/multilayer PCB board/immersion gold PCB 2: Capability: 500Sq. M/per month 1: Used For Mobile, IC Encapsulation 2: Capability: 500Sq. M/per month 3: Lead time: 7days(Sample Order) 1~2 Weeks(Mass Order) 4: Good Quality 5: 6 Layer PCB/multilayer PCB board/immersion gold PCB

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OEM Fr4 Material Immersion Gold 8 Layer PCB with 1.6mm Board Thickness for Mobile Product (FEI272)

8 layer PCB for mobile product Excellent quality Prompt delivery Certificate compliant 8 layer PCB for mobile product, professional manufacturer in China Materials: FR-4 Board Thickness: 1.6mm Surface processing: Immersion gold Laser drill hole(minimum): 0.15mm Buried and blind via structure: L1-L2

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FR4 1.6mm Board Thickness 10 Layer PCB with Immersiongold, Gold Finger Surface Design (FEI264)

10 Layers PCB 1) Layer: 10 L 2) Material: FR-4 3) Boardthickness: 1, 6mm 4) Surface treatment: Immersiongold, gold finger

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FR4 1.6mm Board Thickness 10 Layer PCB with Immersiongold, Gold Finger Surface Design (FEI262)

10 Layers PCB 1) Layer: 10 L 2) Material: FR-4 3) Boardthickness: 1, 6mm 4) Surface treatment: Immersiongold, gold finger

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Custom OEM 4 Layer Gold Finger Multilayer Board with FR4 Materials (FEI253)

Layer: 4 layer Materials: FR4 Board thickness: 1.6mm Copper thickness: 1OZ Finishing: Gold finger Minimum hole size: 0.25mm

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Custom Design 8 Layer 2 Oz Copper Thickness Fr4 Multilayer Reseau Boards (FEI252)

Layer: 8 layer Materials: FR4 Board thickness: 2.0mm Copper thickness: 2 OZ Finishing: Immersion Gold Minimum hole size: 0.25mm

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Custom 2 Layer 1 Oz Copper Thickness Multilayer Board with Fr4 Materials Services (FEI250)

Layer: 2 layer Materials: FR4 Board thickness: 1.0mm Copper thickness: 1OZ Finishing: Immersion Gold Minimum hole size: 0.20mm

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Custom 6 Layer 1.6mm 1 Oz Copper Thickness Multilayer Printed Circuit Board (FEI248)

Layer: 6 layer Materials: FR4 Board thickness: 1.6mm Copper thickness: 1 OZ Finishing: Immersion Gold Minimum hole size: 0.30mm

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OEM 8 Layer 2 Oz Copper Thickness Gold Finger Multilayer Board with FR4 Materials (FEI247)

Layer: 8 layer Materials: FR4 Board thickness: 1.6mm Copper thickness: 2OZ Finishing: Immersion Gold Minimum hole size: 0.20mm

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Custom Design 0.15mm Hole HASL 8 Layer Car Electronics Multilayer Board (FEI254)

Layer: 8 layer Materials: FR4 Board thickness: 1.6mm Copper thickness: 1 OZ Finishing: HASL Minimum hole size: 0.15mm

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