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PCB NVR Main Board PCB

Specification:Layer 1MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space12/12 milMin Hole Size8 milOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic s

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8layer Multilayer Rigid Mainboard PCB for TV

Specifiction:layer:8 layersboard thickness:.1.6mmcopper thickness:1ozmin line width and distance:4/4milmin Hole size:0.3mmsurface treatment: ENIGTG value:tg150About us:Iso 9001,14001,TS16949,UL Certified.With 900+staff,registered capital USD1.3million,full-process workshop,we make 1~20layers board i

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Power Supply Power PCB with 3mil Enig

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Power Supply Power PCB with BGA

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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10-Layer PCB with Imersion Gold Used in Automotive

Specifictionlayer:10layerboard thickness:2,0 mmcopper thickness:2ozmin line width and distance:4/4milmin Hole size:0.3mmsurface treatment:imersion goldTG value:tg135Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingl

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12 Stratification Gold Plate PCB

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

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Automatic Industry Multilayer PCB

Specification:Layer:6Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry PCB

Specification:Layer:6Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Double-Layer Power Pb Free PCB with Heavy Copper

Specifiction:layer:2 layerboard thickness:2.4 mmcopper thickness:3ozmin line width and distance:5/5milmin Hole size:0.4mmsurface treatment: HAS Lead freeAbout us:Iso 9001,14001,TS16949,UL Certified.With 900+staff,registered capital USD1.3million,full-process workshop,we make 1~20layers board in guar

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4 Layer Mainboard Player PCB Circuit with BGA

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingENIG 3U''Min Line Width/Space 8/8mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25,000sqm

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Customized Heavy Copper PCB for Power Supply with Gold Plated

Specification:Layer 2MaterialFR4-TG170Board Thickness2.0mmCopper Thickness3ozSoldermaskGreenSilkscreenWhiteSurface Finishinggold platingMin Line Width/Space8/10 milMin Hole Size12 milWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass P

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2 Layer USB Flash Drive PCB Circuit with Gold Finger

Specification:Layer:2Material type: FR-4-TG135Board thickness: 1.6 mmOuter Copper thickness: 1 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 12mil (0.3mm)- Min. Line Spacing:12mil (0.3mm)Surfac

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4 Layer Telecommunication Circuit Board PCB with Arlon Material

Layer:4Material type: Arlon 25NBoard thickness: 1.6 mmOuter Copper thickness: 2 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 8mil (0.2mm)- Min. Line Spacing: 8mil (0.2mm)Surface finishing :ENI

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Double Sided PCB Circuit Board for Antenna Circuit PCB

Layer:2Material type: FR-4-TG180Board thickness: 1.6 mmOuter Copper thickness: 2 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 10mil (0.25mm)- Min. Line Width: 12mil (0.3mm)- Min. Line Spacing: 12mil (0.3mm)Surface finishing

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Medical PCB for Blood Analyzer

Category: Blood analyzerP/N:M04C01366Material:Table light(EM-825)Layer count:4cMin line width/space:0.2mm/0.2mmMin hole size:0.4mmMin hole copper thickness:25umSurface copper thickness:35umSurface finish:ENIGTin thickess:>=1.97u"About us:With 900workers,full-process equippted(including lamination.im

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Medical PCB for Blood Analyzer

Category: Blood analyzerP/N:M04C14686Material:Table light(EM-825)Layer count:4LMin line width/space:0.2mm/0.2mmMin hole size:0.4mmMin hole copper thickness:25umSurface copper thickness:35umSurface finish:ENIGTin thickess:>=1.97u"About us:With 900workers,full-process equippted(including lamination.im

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Power Supply with Copper Thickness4oz PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Rigid Flex 6L PCB Printed Circuit Board

SEMG Printing & Acoustic FabricsSEMG provides the high tension and low elongation of polyester mesh, with SGS and MSDS certificates,and applicable to the high precise printing for the industries of printed circuit boards, touch panel, glass and textile, cellphones etc.And alsoproviding the advanceda

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Rigid Flex 2 Printed Circuit Board PCB

SEMG Printing & Acoustic FabricsSEMG provides the high tension and low elongation of polyester mesh, with SGS and MSDS certificates,and applicable to the high precise printing for the industries of printed circuit boards, touch panel, glass and textile, cellphones etc.And alsoproviding the advanceda

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Multilayer Gold Plating Board BGA Bonding HDI PCB

Specification:layer4materialfr4TG valuetg150board thickness1.0mmcopper thickness2ozminimum line width/distance5/5milminimum hole siza0.4mmsolder mask clourgreensilkscreenwhitesurface treatmentgold platingAbout us:With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24

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