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Illumination Multilayer PCB

Specification:Layer 6MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Multilayer PCB for Driving Control System

Specification:Layer 6MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Automatic Industry 6-Layer PCB

Specification:Layer 6MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Driving Control System Multilayer PCB

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Intelligent Meter Multilayer PCB

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Automatic Industry 4-Layer PCB

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Power Supply Power PCB with 3mil Enig 3oz Copper

Specification:Layer 2MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Automobile Sensor Multilayer PCB

Specification:Layer 2MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25

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Network Video Recorder Automatic Industry Multilayer PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry Multilayer PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry Multilayer PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry Multilayer PCB

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskBlackSilkscreenNoSurface FinishingGold FingerMin Line Width/Space 12/12 mil Min Hole Size 12 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25,000s

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Automatic Industry Multilayer PCB

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskBlackSilkscreenNoSurface FinishingGold FingerMin Line Width/Space 12/12 mil Min Hole Size 12 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25,000s

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Power Supply Power PCB with 3mil Enig 4oz Copper

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskBlackSilkscreenNoSurface FinishingGold FingerMin Line Width/Space 12/12 mil Min Hole Size 12 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25,000s

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PCB NVR Main Board PCB

Specification:Layer 1MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space12/12 milMin Hole Size8 milOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic s

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Power Supply Power PCB with 3mil Enig

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Power Supply Power PCB with BGA

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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10-Layer PCB with Imersion Gold Used in Automotive

Specifictionlayer:10layerboard thickness:2,0 mmcopper thickness:2ozmin line width and distance:4/4milmin Hole size:0.3mmsurface treatment:imersion goldTG value:tg135Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingl

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12 Stratification Gold Plate PCB

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

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Automatic Industry Multilayer PCB

Specification:Layer:6Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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