10 Layer High Frequency Circuit Board PCB RO4350b with RO4450b Applied in Broadbandwireless Solutions
Price: |
US $ 0.05-0.21/Piece |
Min Order: |
1/Piece |
Pay Type: |
L/C,T/T,Western Union,Paypal |
Prod Model: |
L012 |
Board Thickness: |
1.6mm |
Copper Thickness: |
1oz |
Material Type: |
Fr4 |
Surface Treatment: |
HASL Lead Free |
Solder Mask: |
Green, Red, Blue, Black |
Silk Screen Color: |
White |
Board Layer: |
1-50 |
Shipping Type: |
DHL, UPS, TNT, EMS, FedEx etc |
Packing Type: |
Carton + Vacuum |
Lead Time: |
5-7 Days |
Type: |
Rigid Circuit Board |
Dielectric: |
FR-4 |
Material: |
Fiberglass Epoxy |
Flame Retardant Properties: |
V1 |
Base Material: |
Fr4 |
Brand: |
Fastline |
Product Description
Product Description
10 Layer High Frequency Circuit Board PCB RO4350B With RO4450B Applied In Broadband Wireless SolutionsCommodity IntroductionThis is a type of RO4350B and RO4450B PCB for the application of Broadband Wireless Solutions.
It's a 10 layer board at 2.0mm thick. The base laminate is from Rogers Corp.. Solder mask and
silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10
boards or panels are packed separately.
Parameters & Data SheetPCB SIZE | 215 x 178mm=1PCS=1design |
BOARD TYPE | |
Number of Layers | Multilayer High Frequency PCB, 10 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | NO |
LAYER STACKUP | TOP Layer: signal - 1/2oz foil + 25μm Cu |
Core RO4350B -0.254mm |
INT 1: mixed - 1/2oz foil |
Prepreg RO4450B -0.202mm (2 x 0.101) |
INT 2: mixed - 1/2oz foil |
Core RO4350B -0.254mm |
INT 3: mixed - 1/2oz foil |
Prepreg RO4450B -0.202mm (2 x 0.101) |
INT 4: mixed - 1/2oz foil |
Core RO4350B -0.254mm |
INT 5: mixed - 1/2oz foil |
Prepreg RO4450B -0.202mm (2 x 0.101) |
INT 6: mixed - 1/2oz foil |
Core RO4350B -0.254mm |
INT 7: mixed - 1/2oz foil |
Prepreg RO4450B -0.202mm (2 x 0.101) |
INT 8: mixed - 1/2oz foil |
Core RO4350B -0.254mm |
BOT Layer: signal - 1/2oz foil + 25μm Cu |
TECHNOLOGY | |
Minimum Trace and Space: | 5.5mil/5mil |
Minimum / Maximum Holes: | 0.3/2.0mm |
Number of Different Holes: | 9 |
Number of Drill Holes: | 7505 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | NO |
BOARD MATERIAL | |
Glass Epoxy: | RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil) |
Final foil external: | 1oz |
Final foil internal: | 0.5oz |
Final height of PCB: | 2.0mm ±10% |
PLATING AND COATING | |
Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel) |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), via tented. BGA package |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Broadband wireless solutions, Wifi Usb Dongle Modem Router Wireless Gsm Tracker Antena Wireless Bluetooth |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Microsection Hole Wall (um)Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um |
NO. | A | B | C | D | E | F | AVE |
1 | 22.800 | 22.300 | 23.700 | 23.700 | 22.300 | 24.500 | 23.000 |
2 | 27.000 | 22.300 | 22.500 | 22.500 | 22.500 | 22.600 | 23.600 |
3 | 23.000 | 22.300 | 27.000 | 27.000 | 22.300 | 22.800 | 23.400 |
Outline dimension Unit: mmNO. | Required Dimension (toerance) | Actual dimension |
1 | 97.00 | ±0.15 | 97.02 | 97.01 | 97.01 | 97.02 |
2 | 100.00 | ±0.15 | 100.02 | 100.01 | 99.99 | 100.01 |
Hole Size and Slot Dimension (mm)NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension |
1 | 0.250 | ±0.076 | Y | via | via | via | via |
2 | 0.406 | ±0.076 | Y | via | via | via | via |
3 | 3.174 | ±0.076 | Y | 3.200 | 3.175 | 3.175 | 3.200 |
Workshop:

Our service: PCB capability and services: |
1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. |
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc. |
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment. |
4. Quantities range from sample to mass order |
5. 100% E-Test |
SMT(Surface Mounting technology),DIP. |
1. Material Sourcing Service |
2. SMT assembly and Through hole components insertion |
3.100% AOI testing |
4. IC pre-programming / Burning on-line |
5.ICT testing |
6.Function testing as requested |
7.Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) |
8.Conformal coating |
9.OEM/ODM also welcomed |
Contact us:Web: www.fastlinepcb.com
Fastline is a Leading PCB manufacturer in China. It was found in 2003, serving customers in over 40 countries from various electronic industries, Over 70% of products are exported to America, Europe and other Asia Pacific countries.
Fastline could meet all your PCB manufacturing needs, including High multilayer PCB, Aluminum based PCB, HDI PCB, Rigid-flex PCB, heavy copper PCB, and PCB assembly as well. Our products are widely applied in telecom, industrial control, power electronics, medical instrument, security electronics, aerospace and so on.
And provides "PCB One-stop PCB solution" to meet customers' diverse demands.
Our factories with a facility area of more than 40, 000 square meters with 1000 professional staff, And we have got the approval of ISO9001 certificates. ULCertification and all Products Meet RoHS compliance.
Fastline Circuits is commited to provide superior quality products and services that consistently meet and exceed our customers requirements on time, every time!
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