High-Standard Assembled PCB Manufacturer

Prod Model:	BP002
Markets:	North America,South America,Eastern Europe,Southeast Asia,Africa,Oceania,Mid East,Eastern Asia,Western Europe
Type:	Rigid Circuit Board
Dielectric:	FR-4
Material:	Fiberglass Epoxy Resin + Polyimide Resin
Flame Retardant Properties:	HB

Product Description

What products and services we offer:

Excepting OEM PCB, i.e. Telecommunication, PC Add-On Card, IT Application, Network Device, Multi Layers FR-4 product, we have some outstanding products as follows:

1. Carbon Built on PCB:Apply for Thick Film Technology to make the PCB with buried resistors or touch pad function.
2. Thin PCB:Less than 16 mil thickness in 4 or 6 layers FR-4 production is another challenge for our production capability.
3. CSP // BGA PCB:Those kinds of PCB are increasing and we expect the quantity will be over 10% of our production in coming years. 
4. Special Service: In addition to devote in normal PCB process, our engineering team also provide design support as requested by clients

 

Feature		Process Capability
Line Width/Space	H oz ( inner-layer )	Min.2.0/2.0mil (0.05/0.05mm)
	1 oz ( inner-layer )	Min.2.4/2.4mil (0.060/0.060mm)
	2 oz ( inner-layer )	Min.4.0/5.0mil (0.10/0.05mm)
	1/3 oz ( outer-layer )	Min.2.0/2.0mil (0.05/0.05mm)
	H oz ( outer-layer )	Min.3.0/3.0mil (0.076/0.076mm)
Impedance	Microstrip	+/- 10%
	Differential	+/- 10%
Warpage	Long side
Working Panel Size	Max.	21" x 24" ( 5334 x 6096mm)

Brain Power's Strength:

Excellent quality stability.
Excellent process and handling control.   (Thus impedance yield can achieve to 98% !)
High customer satisfaction.
Thin Board Production with 2 mils core.
Different Impedance technique leader in the RAM module market.
Tight board thickness tolerance(+/- 3 mils) control.


 Before quote, please offer:

1. Gerber file
2. Base material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ Rogers
3. Board thickness
4. Surface treatment
5. Copper thickness
6. Color of solder mask and silkscreen