Low Cost Cem-1 Circuit Board, Manufacturing in China
| Price: |
US $ 0.49-0.67/Piece |
| Min Order: |
1/Piece |
| Pay Type: |
L/C,T/T,Western Union |
| Type: |
Combining Rigid Circuit Board |
| Dielectric: |
CEM-1 |
| Material: |
Fiberglass Epoxy Resin + Polyimide Resin |
| Flame Retardant Properties: |
HB |
Product Description
Low Cost CEM-1 Circuit Board, Manufacturing in China
Production Description| Layer Count | 1 to 22 layer |
| Material Type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers.etc. |
| Board Thickness | 0.21mm to 7.0mm |
| Copper Thickness | 0.5 oz to 7.0 oz |
| Min. Line Width&Space | 3/3 mil |
| Min. Mechnical Hole | 0.15mm(0.8mm for Alu PCB) |
| Min.Solder Mask Dam | 0.075mm |
| Max.Aspect Ratio | 10:01 |
| PTH Size Tolerance | +/- 0.05mm |
| Impedance Control Tolerance | +/- 8% |
| Routing Tolerance | +/- 0.1mm |
| Electric Strength | >103KV/mm |
| Current Breakdown | 10A |
| Solder Mask Abrasion | >6H |
| Solder Mask Color | Green/Black/White/Red/Blue/Matt Blue/Matt Black |
| Silkscreen Color | Yellow/Black/White/ Orange/Grey |
| Surface Finishing | HASL / HASL lead free,OSP,
Tin Plating, Silver Plating
Immersion Silver/Tin, ENIG, Hard Gold plating |
| PCB Packing | Inner Packing :Vacuum Packing /Plastic bag
Outer Packing :Standard carton packing |
CEM-1 Circuit Board Manufacturing CapabilitiesOur CEM-1 circuit board manufacturing capabilities can meet almost 95% demand of customer requirements and actually we concentrated on this field for decades, so plant facilities have been advanced to high level and your intelligent manufacturing could be well handled here| Total Pad Size | Standard | Advanced |
| Capture Pad | Drill + 0.008 | Drill + 0.006 |
| Landing Pad | Drill + 0.008 | Drill + 0.006 |
| BC Mechanical Drill (Type III) | 0.008 | 0.006 |
| Laser Drill Size | 0.004-0.010 | 0.0025 |
| Material Thickness | 0.0035 | 0.0025 |
| Stacked Via | Yes | Yes |
| Type I Capabilities single & Double Deep | Yes | Yes |
| Type II Capabilities Buried Vias with Microvias | Yes | Yes |
| Type III Capabilities | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| Smallest Copper Filled Microvia | 0.004 | 0.0025 |
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | c |
CEM-1 Circuit Board Manufacturing Process
About UsAs a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our headquarter is located in Guangzhou, China. We have 10,000 square meters plant, 287 employees and 42 engineers, monthly capabilities of 15,000 square meters PCB design & fabrication and 80 million spot SMT. We were approved by ISO9001-2008, TS16949, UL, CE, RoHS.Our customers are widely distributed in mainland China, Taiwan, the United States, Japan, Singapore, Korea, Russia, Germany, Switzerland and other parts of the word.
Your CEM-1 circuit board demand will be perfectly handled by our professional production line and responsible work team.
As a service-leading PCB manufacturing and PCB assembly (PCBA) partner, NOD Electronics strives to support international small-medium business with 10+ years engineering experience in Electronic Manufacturing Services (EMS). Our headquarter is located in Guangzhou, China. We have 10, 000 square meters plant, 287 employees and 42 engineers, monthly capabilities of 15, 000 square meters PCB design & fabrication and 80 million spot SMT. We were approved by ISO9001-2008, TS16949, UL, CE, RoHS.
We strive to be your rightest partner in electronic manufacturing serivce with a commitment from creative team members. Do you agree that every electronic product has its soul, bearing the designer's product concept, just like the Apples and Steve Jobs? Electronic product is a bridge between the customer and designer rather than a cold and ruthless object. Although they have no verbal communication, they have soul connection in between.
So, we perform and create a bridge, which turns your concept or design into a product and present in front of the customers by offering reliable manufacturing solutions and engineering support, including New Product Introduction (NPI), Printed Circuit Board (PCB) design, Printed Circuit Board Assembly (PCBA), Casing (plastic & mental) solutions.
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