Special resistance or impedance controled FPC
Base materials: 1-mil PI, 1-mil ADH, 1-mil constant
Dimensions: 250 x 285mm
Cover layer tolerance: ±0.3mm
Pad tolerance: ±0.1
Advantage:
1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Process capability:
Base film thickness:
Polyamide: 12.5, 25, 35, 50um
Polyester: 12.5, 25, 35, 50um
Copper thickness: 12, 17.5, 35, 50, 70, 105um
Minimum line width/line space: 0.075/0.075mm
Minimum hole size: 0.2mm
Tolerance: outline ±0.05/cover layer ±0.2mm
Peel strength:
Polyamide: above 1.0kgf/cm
Polyester: above 0.8kgf/cm
Solder resistance:
Polyamide: 260°C, 10 seconds
Polyester: 204°C, 5 seconds
Surface finishing/treatment: HASL/lead-free HASL, immersion gold, gold plating immersion silver, immersion tin and OSP
Certificates: UL and TS16949
Product meets RoHS and WEEE lead-free requirement
| Main Technique Index |
| Description | Parameters |
| Polyimide | Polyester |
| Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
| Copper Thickness (um) | 12,17.5,35,50,70,105 |
| Min. Line Width/Line Space (mm) | 0.075/0.075 |
| Min. Hole Size (mm) | 0.15 |
| Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 |
| Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
| Solder Resistance | 260C 10 seconds | 204C 5 seconds |
|
|
|
| Surface Treatment |
| Content | Normal coating thickness | Normal PNL size |
| Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
| Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
| Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
| OSP (In house) | N/A | 300mm×400 MM |
| ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
| Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM
|
Xiamen Bolion Ciruit Co., Ltd is an expert manufacturer that specializes in flexible Circuit boards & Rigid-Flex PCB based in China since 2003.
All of our facilities are ISO 9001, ISO 13485(Medical decices), ISO 14001, TS 16949(Automotive) RoHS, and UL(E228871) certified. This investment into equipment and training has transformed Bolion into a global supplier of Ultra-High Quality flexible and rigid-flex boards.
The key markets we serve are primary located in North America and Europe include Top 500 companies in the Medical, Automotive, Wearable, and CM/EMS industries.
Bolion Tech major in High-mix Low volume production, provide quality, cost-effective solution, on time for our customers.
Quick lead-times:
-Single layer Flex: 2~5 days
-Double layer Flex: 2~5 days
-Multi-layer Flex(Max. 12 layers): 4~8 days
-Rigid Flex: 5~8 days
Bolion's commitment to you is that we will strive to become a full member of your engineering and manufacturing team focused on delivering you high quality products and service, on time, while achieving your stated technical and cost goals.
Bolion Business extends: With more than 13 years developing, Bolion now add in house SMT line, devoted to provide one-step service for our customers.
If you are interested in finding an FPC/Rigid-Flex PCB and SMT supplier in China, please freely contact us, I do believe Bolion will be your good choice.
