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2-Layer Fr4 Small Size PCB with Routing Slot

Specifiction:layer:2 layerboard thickness:1 mmcopper thickness:1ozmin line width and distance:5/5milmin Hole size:0.4mmsurface treatment: ENIGTG value:tg135Our main process capability:Our main process capability:Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Board Thickness0.2-5

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12 Stratification Gold Plate PCB

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

SEATTLE ELECTRONICS MANUFACTURING GROUP (HK) CO., LTD. Send Inquiry

PCB Llayout Designer Bluetooth Headset Circuit Board

PCB Llayout Designer Bluetooth headset Circuit BoardCompanyprofile:AsanexperiencedPCBandPCBAmanufacturer,weprovideprototypes,smallvolume,mediumvolume,andhighvolumeprojects.Weareabletoguaranteeacompleteservicewithcomprehensivetechnicalbackup,offeringacostadvantageandscheduleddelivery.Ourmainservicesi

Shenzhen Rigao Electronics Co., Ltd. Send Inquiry

Automatic Industry Multilayer PCB

Specification:Layer:6Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry PCB

Specification:Layer:6Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Double Sided Combining Hard and Soft Board

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

SEATTLE ELECTRONICS MANUFACTURING GROUP (HK) CO., LTD. Send Inquiry

Eight Resin Tiles Printed Circuit Board

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

SEATTLE ELECTRONICS MANUFACTURING GROUP (HK) CO., LTD. Send Inquiry

Single-Sided Aluminum LED PCB for Light with Pb-Free HASL

Specifiction:layer:Single layerboard thickness:.1.6mmCopper thickness:1ozThermal conductivity: 2.0w/mkmin Hole size:1.2mmsurface treatment: HASL lead freeWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layers

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Double-Sided Aluminum Base PCB for LED Light 2-Layer Aluminum

Specifictiolayer:2L Aluminumboard thickness:.1.6mmCopper thickness:1ozsurface treatment: HASL lead freeWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material:ROGERS, Arlon, Taconic.etc.Client:

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Single-Layer Aluminum PCB with Lead-Free HASL and White Mask

Specifiction:layer:Single layerboard thickness:.1.6mmCopper thickness:1ozThermal conductivity: 1.0w/mkmin Hole size:1mmsurface treatment: HASL lead freeWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSp

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2-Layer Imerision Gold Blue Solder Mask PCB for MP4

Specifiction:layer:2 layermaterial:fr4 kbboard thickness:.1.6mmcopper thickness:2ozmin line width and distance:7/7milmin Hole size:0.5MMsurface treatment: ENIGTG value:tg135Application:MP4Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basi

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Double-Layer Power Pb Free PCB with Heavy Copper

Specifiction:layer:2 layerboard thickness:2.4 mmcopper thickness:3ozmin line width and distance:5/5milmin Hole size:0.4mmsurface treatment: HAS Lead freeAbout us:Iso 9001,14001,TS16949,UL Certified.With 900+staff,registered capital USD1.3million,full-process workshop,we make 1~20layers board in guar

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4 Layer Mainboard Player PCB Circuit with BGA

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingENIG 3U''Min Line Width/Space 8/8mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25,000sqm

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Gold Supplier 4 Layer PCB for Building Management System

Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 8/8mil Min Hole Size 8 milPCB Packing - Inner packing: Vacuum packing / plastic Bag- Outer packing: Standard carton packingCertificate: UL, ISO 9001, ISO 1

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Customized Heavy Copper PCB for Power Supply with Gold Plated

Specification:Layer 2MaterialFR4-TG170Board Thickness2.0mmCopper Thickness3ozSoldermaskGreenSilkscreenWhiteSurface Finishinggold platingMin Line Width/Space8/10 milMin Hole Size12 milWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass P

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Fr4 Double Sided PCB Circuit for Stereo System

Layer 2MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HASLMin Line Width/Space 12/12 mil Min Hole Size 8 milFactory Tour:Capability:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,

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Frequency Converter PCB Industrial Control PCB Circuit

Layer:2Material type: FR-4-TG135Board thickness: 1.6 mmOuter Copper thickness: 4 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 12mil (0.3mm)- Min. Line Spacing:12mil (0.3mm)Surface finishing :E

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2 Layer USB Flash Drive PCB Circuit with Gold Finger

Specification:Layer:2Material type: FR-4-TG135Board thickness: 1.6 mmOuter Copper thickness: 1 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 12mil (0.3mm)- Min. Line Spacing:12mil (0.3mm)Surfac

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4 Layer Telecommunication Circuit Board PCB with Arlon Material

Layer:4Material type: Arlon 25NBoard thickness: 1.6 mmOuter Copper thickness: 2 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 8mil (0.2mm)- Min. Line Spacing: 8mil (0.2mm)Surface finishing :ENI

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6 Layer Customized Telecom Circuit Bord with Rogers Material PCB

Layer:6Material type: Rogers 4535Board thickness: 1.6 mmOuter Copper thickness: 2 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 8mil (0.2mm)- Min. Line Width: 3mil (0.075mm)- Min. Line Spacing: 3mil (0.075mm)Surface finishing

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