>> Multilayer Pcb

Fr4 Lead Free Hal 4 Layer PCB for Tablet PC

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLF-HALMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpeci

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Quality Assured Multilayer PCB for LCD Display

Specification:Layer 4MaterialFR4-TG150Board Thickness1.2mmCopper Thickness1ozSoldermaskGreenSilkscreenWhiteSurface FinishingLF-HALMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpeci

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Blue Solder Mask 4 Layer PCB for Ultrabook

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingENIGMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial

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WiFi Module PCB

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

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4 Layer Immersion Tin PCB for Notebook Computer

Specification:Layer 4MaterialFR4-TG180Board Thickness1.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingImmersion TinMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20laye

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Multilayer Laptop PCB with Countersink Hole

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 2 OZCopper thickness in hole :> 25.0 umSize - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 8mil (0.2mm)- Min. Line Spacing: 12mil (0.3mm)Surfac

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4 Layer PCB with Green Solder Mask and Ipc Class 3

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingLF-HALMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpeci

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Card PCB Board with Gold Fingers

Specification:Layer 8MaterialFR4-TG150Board Thickness2.0mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingGold platingMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layer

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6 Layer PCB for Detection Equipment with Immersion Gold

Specification:Layer 6MaterialFR4-TG150Board Thickness1.6mmCopper Thickness2ozSoldermaskBlueSilkscreenWhiteSurface FinishingENIGMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial

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8 Layer Multi-Layer PCB for Communication Products in Enig

Specification:Layer 8MaterialFR4-TG170Board Thickness2.0mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingENIGMin Hole Size 0.3mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial

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Thin 4 Layer PCB with Board Thickness of 0.4mm

Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material:ROGERS, Arlon, Taconic.etc.Client:SAMSUNG, Skyworth, Malata, Midea.etc.Capability & Lead Time:Certificates(UL:E246887, TS16949, ISO14001,

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Home Appliance PCB with Red Solder Mask and RoHS-Compliant

UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material:ROGERS, Arlon, Taconic.etc.Client:SAMSUNG, Skyworth, Malata, Midea.etc.Capability & Lead Time:Certificates(UL:E246887, TS16949, ISO14001, ISO900

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2 Layer Chemical Ni/Au PCB for Medical Equipment

Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material:ROGERS, Arlon, Taconic.etc.Client:SAMSUNG, Skyworth, Malata, Midea.etc.Capability & Lead Time:Certificates(UL:E246887, TS16949, ISO14001,

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6 Layer Medical PCB with BGA

Specification:Layer 6MaterialFR4-TG150Board Thickness1.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingENIGMin Hole Size 0.2mmWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial

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Multilayer Fr4 Hot Selling PCB Board Manufacturer

Specifiction:layer:4layersboard thickness:1.2mmCopper thickness:1ozmin Hole size:0.35mmmin line width and distance:4.5mil/4.5milSurface treatment: ENIGApplication:consumer electronicsWhyus:1 Iso 9001,14001,TS16949,UL Certified.2 900+staff,registered capital USD1.68million.3 Full-process workshop-lam

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Multilayer PCB for Science & Teaching Instrument

We're a large PCB factory in China, with core competencyof series production of high quality PCBs.Production Capacity: 85K sqm/month FR4(2-24 layer) and IMS(Alu) boards;WehavebeeninPCBmarketformorethan11yearsand knowcustomers'requirementsandtryourbesttoofferthemostcompetitivesolutiontocustomers.Qual

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4 Layer Enig PCB for Industry Control

We're a large PCB factory in China, with core competencyof series production of high quality PCBs.Production Capacity: 85K sqm/month FR4(2-24 layer) and IMS(Alu) boards;WehavebeeninPCBmarketformorethan11yearsand knowcustomers'requirementsandtryourbesttoofferthemostcompetitivesolutiontocustomers.Qual

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HDI PCB High Density Interconnector PCB with Buried and Blind Via

Specification:Layer 2MaterialFR4-TG180Board Thickness2.6mmCopper Thickness2ozSoldermaskGreenSilkscreenWhiteSurface FinishingLead Free HAL+ENIGMin Line Width/Space4/4 milMin Hole Size0.4mmOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic

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FPC01 Printed Circuit Board PCB

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

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6layers Imerision Gold PCB with Impedance Control Test Bar

Specifiction:layer:6layerboard thickness:1.6mmCopper thickness:1ozmin Hole size:0.2mmmin line width and distance:4mil/4milImpedance control:9%Surface treatment: ENIGApplication:consumer electronicsWhyus:1 Iso 9001,14001,TS16949,UL Certified.2 900+staff,registered capital USD1.68million.3 Full-proces

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