Flex-Rigid 4-Layer Pressfit PCB for Industry Control

Layers:4Thicknes: 1.5 ±0.15mmSurface Treatment: ENIGParametersImpedancePressfit HoleCounterboreCraftsIndustry controlApplications

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6oz Copper Laser Drilling 16L PCB for Electric Power

Specification:Layers:16Thickness:3.8±0.3mmSurface Treatment: ENIGParametersMaterial: SY ST115Thermal conductivity is 1.5W/m·kBack Drilling Laser DrillingCraftsElectrical PowerApplicationsProfiling: Routing, V-CUTOur main process capability:ItemsStandardAdvancedLayer Count1-201-24Base M

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36-Layer PCB 16: 1 Aspect Ratio for Communication

Specification:Material type: FR-4-TG170Layers: 36Thicknes: 8.0±0.8mmMin. Hole Size: 0.508mmWidth/Space: 0.381mm/0.18mmSurface Treatment:ENIGParametersINNER LAYER 4OZASPECT RATIO 16:1CraftsCommunicationApplicationsSolder Mask Color: GreenSilkscreen: WhitePCB Packing - Inner packing: Vacuum pac

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Gold Finger 10micinch Red Oil 10-Layer PCB

Specification:Layer 4MaterialFR4-TG150Board Thickness1.6mmCopper Thickness1ozSoldermaskRedSilkscreenWhiteSurface Finishinggold platingMin Line Width/Space 4/4 mil Min Hole Size 8 milCapability:Lead Time:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD 50-100 million per year25,000sq

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Network Video Recorder Automatic Industry Multilayer PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry Multilayer PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Automatic Industry Multilayer PCB

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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4layer Blue Soldermask PCB for Famous Car DVR

Specifiction:layer:4 layerMaterial:KB fr4board thickness:1.6mmcopper thickness:1.5ozmin line width and distance:8/8milmin Hole size:0.8mmsurface treatment: OSPTG value:tg150Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionf

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8layer Multilayer Rigid Mainboard PCB for TV

Specifiction:layer:8 layersboard thickness:.1.6mmcopper thickness:1ozmin line width and distance:4/4milmin Hole size:0.3mmsurface treatment: ENIGTG value:tg150About us:Iso 9001,14001,TS16949,UL Certified.With 900+staff,registered capital USD1.3million,full-process workshop,we make 1~20layers board i

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4 Layer Fr4 PCB with Pb-Free HASL for Car Electronics

Specifiction:layer:4 layerMaterial:KB fr4board thickness:.2.0mmcopper thickness:2ozsurface treatment: pb freeTG value:tg135Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20layersSpecial Material:ROGERS, Arlon,

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Double-Sided Pb Free LCD Module PCB with Black Oil

Specifiction:layer:2 layerboard thickness:.1.6mmcopper thickness:Hozmin line width and distance:8/8milmin Hole size:0.3mmsurface treatment: pb freeTG value:tg150Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto2

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Enig PCB with Peters Peelable Mask (SD-2955 & SD-2954)

Specifiction:layer:4 layerboard thickness:.1.6mmcopper thickness:1ozmin line width and distance:4/4milmin Hole size:0.3mmsurface treatment: ENIG/peters peelable maskTG value:tg150Our main process capability:ItemsStandardAdvancedLayer Count1-201-24Base MaterialCEM1,CEM3,FR4,IMS(Aluminum)basic supplie

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4layer Multilayer Enig PCB for LCD Module with BGA

Specifiction:layer:4 layerboard thickness:.1.6mmcopper thickness:1ozmin line width and distance:3/3milmin Hole size:0.25mmsurface treatment: ENIGTG value:tg135BGA size:0.2mmAbout us:Iso 9001,14001,TS16949,UL Certified.With 900+staff,registered capital USD1.3million,full-process workshop,we make 1~20

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Power Supply Power PCB with 3mil Enig

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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Power Supply Power PCB with BGA

Specification:Layer:4Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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10-Layer PCB with Imersion Gold Used in Automotive

Specifictionlayer:10layerboard thickness:2,0 mmcopper thickness:2ozmin line width and distance:4/4milmin Hole size:0.3mmsurface treatment:imersion goldTG value:tg135Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingl

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Double Sided Fr4 Rigid Printed Circuit Board with OSP

Specification:layer2materialfr4TG valuetg135board thickness1.6mmcopper thickness1ozminimum line width/distance4.6/5milminimum hole siza0.2mmsurface treatmentOSPWhy US:UL(E246887),ISO9001,TS16949,ISO14001certified.Turnover USD50-100 millionper year25,000sqm area,1100staffMass Productionfromsingleto20

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Multi-Layer Polyimide FPC Rigid-Flex PCB with Enig

Specification:layer6materialPolyimideTG valuetg150board thickness1.6mm+0.25mmcopper thickness1ozminimum line width/distance5/5milminimum hole siza0.4mmsolder mask clourgreensilkscreenwhitesurface treatmentimersion goldOur main process capability:Why US:UL(E246887),ISO9001,TS16949,ISO14001certified.T

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12 Stratification Gold Plate PCB

SEMG PCB Fabrication:SEMG produces the samples and small volume of High layer and rigid-flex pcb, and big volume of low techologyPCB.1) Manufacturing facilities in China for a total capacity of over 4.0 million ft2/month, building area: 500,000sq.ft, and typical PCB Equipment includes:Mitsubishi Las

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Automatic Industry Multilayer PCB

Specification:Layer:6Material type: FR-4-TG170Board thickness: 1.6 mmOuter Copper thickness: 4 OZ(140um)Copper thickness in hole :> 25.0 um (>1mil)Size - Max. Board Size: 23 × 25 (600mm×1000mm)- Min. Drilled Hole Size: 12mil (0.3mm)- Min. Line Width: 4mil (0.1mm)- Min. Line Spacing: 4mil

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