Bicheng Enterprise Limited >> 2.4mm Thick 4 Layer Multilayer PCB with Immersion Gold Board

2.4mm Thick 4 Layer Multilayer PCB with Immersion Gold Board

2.4mm Thick 4 Layer Multilayer PCB with Immersion Gold Board
Price: US $ 0.48/Piece
Min Order: 1/Piece
Pay Type: T/T,Western Union,Paypal
Prod Model: BIC-222-V2.22
Outer Copper Foil: 2 Oz
Board Thickness: 2.4mm
Surface Treament: Enig
Solder Mask Color: Blue,R-500 Bl
Legend Color: White,Kuang Shun
Forming: V-Cut
Visual Inspection: Ipc-a-600h&Ipc-6012c
Min Line Width (Mil): 5.2 Mil
Min Line Spacing (Mil): 6.2 Mil
Electrical Test: 100% PCB Passed
Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Flame Retardant Properties: V0

Product Description

2.4mm thick Multilayer 4 Layer PCB 3 equal dielectric thickness with Blue Solder Mask and
ENIG pads in Surveillance Systems



Commodity Introduction
This is a type of FR-4 PCB for the application of Surveillance Systems. It's a 4 layer board at 2.4mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from KUANG SHUA.
It
's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately. 



Parameters & Data Sheet
ItemRequirementResult
LaminateTypeFR-4 Tg170FR-4 Tg170
SupplierITEQITEQ
Board thickness2.4+-10%mm2.38-2.42mm
Outer copper foil>=70 um73.7 um
Inner copper foil2/2 OZ2/2 OZ
Warp-twist<= 0.75%0.03%
LegendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCS CS 
MarkingCo.logoYESYES
UL.logo YESYES
Date codeWWYYWWYY
Marking formN/AOK
LocationCS CS 
Min line width (mil)5.45.2
Min line spacing (mil)66.2
Min ring width (mil)NA  NA  
Solder MaskTypeR-500 BLR-500 BL
ColorBlueBlue
Thickness>=10 um14 um
Pencil Test6H OR ABOVE OK
SOLVENT TESTNO ATTACKOK
TAPE TEST NO PEEL OFFOK
Surface treamentENIGOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passed OK
Visual inspectionIPC-A-600H&IPC-6012COK
Solderability Test 245ºC 5S 1 CycleOK


Learn PCB and Buy PCB
ITEQ is one of our main laminates brand.

ITEQ  Laminate/ Prepreg : IT-140TC / IT-140BS
IPC-4101A Spec / 21
LAMINATE(IT-140TC)
 
PropertyThickness
<0.50 mm
Thickness
>=0.50 mm
UnitsTest 
Method
            [0.0197 in]             [0.0197 in]
Typical 
Value
SpecTypical 
Value
SpecMetricIPC-TM
-650
(English)(or as 
noted)
Peel Strength, 
minimum
    N/mm2.4.8
A.   Low profile 
copper foil 
and very low 
profile copper 
foil - all copper 
weights > 
17mm [0.669 mil] 
    (lb/inch)2.4.8.2
B.   Standard profile 
copper foil
0.96 
(5.5)
0.70 
(4.0)
0.96 
(5.5)
0.70 
(4.0)
 2.4.8.3
1.     After Thermal 
Stress
      
2.     At 125°C 
[257 F]
      
3.     After Process 
Solutions
1.75 
(10 )
0.80 
(4.57)
 1.93 
(11.0)
1.05 
(6.00)
  
 1.66 
(9.5)
0.70 
(4.00)
1.66 
(9.5)
0.70 
(4.00)
  
 1.49
 (8.5)
0.55 
(3.14)
1.49 
(8.5)
0.80 
(4.57)
  
Volume Resistivity, 
minimum
    MW-cm2.5.17.1
A. C-96/35/905x1010106----
B. After moisture 
resistance
----5x1010104
C. At elevated 
temperature 
E-24/125
5x10101035x1010103
Surface 
Resistivity,
 minimum
    MW2.5.17.1
A. C-96/35/903.5x1010104----
B. After moisture 
resistance
----3.5x1010104
C. At elevated
 temperature 
E-24/125
6x10101036x1010103
Moisture 
Absorption, 
maximum
0.3--0.10.8%2.6.2.1
Dielectric
 Breakdown, 
minimum
----6040kV2.5.6
Permittivity (Dk, 
50% resin 
content)
4.65.44.65.4--2.5.5.9
(Laminate & 
Laminated 
Prepreg)
A. 1MHz
Loss Tangent (Df, 
50% resin 
content)
0.0160.0350.0160.035--2.5.5.9
(Laminate & 
Laminated 
Prepreg)
A. 1MHz
Flexural Strength, 
minimum
    N/mm22.4.4
A. Length direction----500-530415(lb/in2)
 ----(72,500-76,850)-60,190 
B. Cross direction----430-460345 
 ----(62,350-66,700)-50,140 
Arc Resistance, 
minimum
1206012060s2.5.1
Thermal Stress 10 
s at 288°C 
[550.4F],minimum
    Rating2.4.13.1
A. UnetchedPassPass 
Visual
PassPass 
Visual
B. EtchedPassPass 
Visual
PassPass
 Visual
Electric Strength, 
minimum
4530----kV/mm2.5.6.2
(Laminate &
 Laminated 
Prepreg)
Flammability, V-0V-0V-0V-0RatingUL94
 (Laminate & 
Laminated 
Prepreg)
Glass Transition 
Temperature
(DSC)
140135 
minimum
140135 
minimum
˚C2.4.25
Decomposition 
Temperature
----305--˚C2.4.24.6
(5% wt 
loss)
Z-Axis CTE      2.4.24
 A.  Alpha 1----55--ppm/˚C
 B.  Alpha 2----290--ppm/˚C
 C.  50 to 260 
Degrees C
----4.2--%
Thermal Resistance     2.4.24.1
A.  T260 ----15--Minutes
B.  T288 ----2--Minutes
CAF Resistance----PassAABUSPass/Fail2.6.25


Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.

The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.

Different plant scale to suit for your requirements

16000 square meter factory building

30000 square meter month capability

8000 types of PCB per month

ISO9001, ISO14001, TS16949, UL Certified

We have our own advantages to help you saving cost and time spent on PCB, booster your new products go to market quickly.

A) Various kinds of PCB products

Double sided PCB

Multilayer PCB up to 32 layers

FR-4 PCB (Tg130, Tg170)

High frequency PCB (RO4350B, RO4003C)

Aluminum PCB (1W/MK, 2W/MK, 3W/MK)

Flexible PCB

HDI PCB Board

B) Multiple PCB technology to meet the market demands

Blind via PCB, Via in pad PCB, Fine pitch BGA PCB

Impedance controlled PCB

Heavy copper PCB

Hybrid material PCB

C) Many discount policies for new customers

SMT stencil foil, free of charge

Prototype shipping cost, free of charge

Prototype test, free of charge

PCB panelization, free of charge

D) High quality PCB services

Engineering design prevents problems from occurring in pre-production.

Meet your PCB needs from prototype to mass volume production.

Eligible products rate of first production: >95%

Delivery on time: >98%, door to door shipment service

Customer complaint rate: <1%

Choose BichengPCB means you choose hassle free.

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