Bicheng Enterprise Limited >> 4 Layer PCB Sample Built on Fr-4 Tg135

4 Layer PCB Sample Built on Fr-4 Tg135

4 Layer PCB Sample Built on Fr-4 Tg135
Price: US $ 1.21/Piece
Min Order: 1/Piece
Pay Type: T/T,Western Union,Paypal
Prod Model: BIC-1138-REV2
Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Flame Retardant Properties: V0
Processing Technology: HASL
Base Material: Copper Clad Laminate
Brand: Bicheng

Product Description

Multilayer PCB Board ITEQ FR-4 Base material Tg135 HASL 361



Commodity Introduction
This is a type of 4 layer PCB for the application of Digital Electronics at 1.6mm thick with HASL Lead Free pad finish. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately.



 
Parameter & Data Sheet
Number of Layers4
Board TypeMultilayer board
Board Thickness1.6mm +/-0.16
Board MaterialFR-4
Board Material SupplierITEQ
Tg Value of Board Material135ºC
 
PTH Cu thickness≥20 um (See hole wall details)
Inner Iayer Cu thicknes17 um(0.5oz)
Surface Cu thickness35 um (1oz)
 
Solder Mask Type and Model No.LPSM, KSM-6189BLM1
Solder Mask SupplierKUANGSHUN
Solder Mask ColourMatt blue
Number of Solder Masks2
Thickness of Solder Mask14 um
 
Type of Silkscreen InkIJR-4000 MW300
Supplier of SilkscreenTAIYO
Color of SilkscreenWhie
Number of Silkscreen2
 
Mininum Trace (mil)9.5 mil
Minimum Gap(mil)6.5 mil
 
Surface FinishHASL Lead free
RoHS RequiredYes
Warpage 0.41%
 
Thermal Shock TestPass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering.
Solderablity TestPass, 255±5ºC,5 seconds Wetting Area Least 95%
Function 100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6012C Class 2

Microsection Hole Wall (um)  
Hole Wall Cu Thickness≥20 um Hole Wall Cu Roughness≤25.4 um
NO.ABCEAVE
124.848 23.648 23.708 25.348 24.628 24.258 24.406
224.620 23.442 23.480 25.120 24.400 24.030 24.182
324.482 23.282 23.342 24.982 24.262 23.892 24.040

Outline dimension  Unit: mm 
NO.Required Dimension (toerance)Actual dimension
1189.99 ±0.15190.06 190.06 189.97 190.11
2160.00 ±0.15159.91 160.11 160.12 160.07

Hole Size and Slot Dimension (mm)
NO.Requerment Dimension (tolerance)PTH/NPTActual dimension
10.900 ±0.075Y0.900 0.875 0.925 0.900
21.200 ±0.075Y1.200 1.175 1.220 1.200
33.200 ±0.075Y3.200 3.175 3.225 3.200



Design For Manufacturability ( 2)
This manufacturability guide provides an overview of various areas that printed circuit board designer may take into consideration on the fabrication possibility, manufacturing cost and reliability of their products. This DFM is divided into 5 parts for our readers. This is the section II.
Serial NO.ProcedureItemManufacturing capability
Large volume  (S<100 m²)Middle volume (S<10 m²)Prototype(S<1m²)
14LaminatingTolerance of laminate thickness±10% PCB thick±10% PCB thick±8% PCB thick
15Maximum laminate thickness4.0mm6.0mm7.0mm
16 Laminate alignment accuracy≤±5 mil≤±4 mil≤±4 mil
17Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.drill bit diameter0.2 mm0.2 mm0.2 mm
18 Min.slot router diameter0.60 mm0.60 mm0.60 mm
19Min.tolerance of PTH slots±0.15mm±0.15mm±0.1mm
20Max.aspect ratio1:081:121:12
21Hole tolerance±3mil±3mil±3mil
22Space of via to via6mil(same net),12mil(different net)6mil(same net),14mil(different net)4mil(same net),12mil(different net)
23Space of component hole to component hole12mil(same net),16mil(different net)12mil(same net),16mil(different net)10mil(same net),14mil(different net)
24EtchingMin.width of etching logo10mil(18um),12 mil (35um),12 mil(70um)8mil(18um),10mil(35um),12 mil(70um)6mil(18um),8 mil(35um),12mil(70um)
25Etch factor1.6-2.21.6-2.21.6-2.2
26Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )Min.via pad diameter20mil16mil16mil
27Min.BGA pad diameter12mil12mil10mil
28Min.track and spacing5/5mil(18um)4/4mil(18um)3/3.5mil(18um)
5/5mil(35um)4/4mil(35um)3/4mil(35um)
7/9mil(70um)6/8mil(70um)6/7mil(70um)
9/11mil(105um)8/10mil(105um)8/9mil(105um)
13/13mil(140um)12/12mil(140um)12/11mil(140um)
29Minimum grid10/10mil(35um)8/8mil(35um)4/8mil(35um)
30Min.space (conductor to pad, pad to pad)6mil(18um)5mil(18um)4mil(18um)
6mil(35um)5mil(35um)4mil(35um)
9mil(70um)8mil(70um)7mil(70um)
11mil(105um)10mil(105um)9mil(105um)
13mil(140um)12mil(140um)11mil(140um)


Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.

The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.

Different plant scale to suit for your requirements

16000 square meter factory building

30000 square meter month capability

8000 types of PCB per month

ISO9001, ISO14001, TS16949, UL Certified

We have our own advantages to help you saving cost and time spent on PCB, booster your new products go to market quickly.

A) Various kinds of PCB products

Double sided PCB

Multilayer PCB up to 32 layers

FR-4 PCB (Tg130, Tg170)

High frequency PCB (RO4350B, RO4003C)

Aluminum PCB (1W/MK, 2W/MK, 3W/MK)

Flexible PCB

HDI PCB Board

B) Multiple PCB technology to meet the market demands

Blind via PCB, Via in pad PCB, Fine pitch BGA PCB

Impedance controlled PCB

Heavy copper PCB

Hybrid material PCB

C) Many discount policies for new customers

SMT stencil foil, free of charge

Prototype shipping cost, free of charge

Prototype test, free of charge

PCB panelization, free of charge

D) High quality PCB services

Engineering design prevents problems from occurring in pre-production.

Meet your PCB needs from prototype to mass volume production.

Eligible products rate of first production: >95%

Delivery on time: >98%, door to door shipment service

Customer complaint rate: <1%

Choose BichengPCB means you choose hassle free.

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