Bicheng Enterprise Limited >> Multilayer PCB 4layer Blue Soldermask with Immersion Gold

Multilayer PCB 4layer Blue Soldermask with Immersion Gold

Multilayer PCB 4layer Blue Soldermask with Immersion Gold
Price: US $ 0.45/Piece
Min Order: 1/Piece
Pay Type: T/T,Western Union,Paypal
Prod Model: BIC-259-V2.59
Finished Thickness: 1.68 mm
Pth Cu Thickness: 25.67um
Inner Layer Cu Thickness: 1/1 Oz
Surface Cu Thickness: 47.60 Um
Surface Treatment: Enig
Solder Mask: Matt Blue,Kuang Shun,Ksm-6189blm1
Legend: White,Tai Yo,S-380W
Trace Width (mm): 0.207mm
Spacing (mm): 0.186 mm
Warp And Twist: 0.21%
Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Flame Retardant Properties: V0

Product Description

Tg135 FR-4 Multilayer 4 Layer PCB 1.68mm Thick with Matt Blue and Immersion Gold
in Alarm Systems



Commodity Introduction
This is a type of FR-4 PCB for the application of Alarm Systems. It's a 4 layer board at 1.6mm
thick.The base laminate is from ShengYi, Solder mask and silkscreen from KUANG SHUN and
Taiyo. It
's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels
are packed separately. 



Parameters & Data Sheet
ItemDescriptionRequirementActual
LaminateLaminate TypeFR4:CTI:175V-249VFR4:CTI:175V-249V
SupplierSHENGYISHENGYI
TgTG >135TG >135
Finished thickness1.6+/--0.16 MM1.68 MM
Plating thicknessPTH Cu thickness23 um25.67um
Inner layer Cu Thickness1/1 OZ1/1 OZ
Surface Cu thickness35 um47.60 um
Solder  MaskMaterial typeKSM-6189BLM1KSM-6189BLM1
SupplierKUANG SHUNKUANG SHUN
ColorMatt blueMatt blue
Single / both sidesBoth SidesBoth Sides
S/M thickness>= 10.0 um26.7 um
3M tape testNO Peel  OffNo peel off
LegendMaterial typeS-380WS-380w 
SupplierTai yoTai yo
ColorWhiteWhite 
LocationBoth SidesBoth  Sides
3M tape testNo peel offno peel off
CircuitTrace Width (mm)0.20+/-20%mm0.207mm
Spacing (mm)0.19+/- 20%mm0.186 mm
IdentificationUL markAs requirementOK
Company LogoAs requirementOK
Date codeWWYYWWYY
Mark locationCSCS
Surface TreatmentENIGNickel100u"113u"
Gold4u"4.11u"
Reliabilty TestsThermal shock test288±5ºC,10sec,
3 cycles
NO Discolor,
NO Delamination
solder abllity test235±5ºC100% Wetting
FunctionElectrioal Test100%pass
StandardIPC-A 600H class 2,
IPC_6012C CLASS 2
 100%Pass
AppearanceVisual inspection100%Pass
warp and twist<= 0.75%0.21%
OthersV-Cut  thickness0.4±0.1 mm0.39mm
Angle30+/- 530º

Finished dimension (unit: mm): including v-cut
NoRequiredActual  Dimension
1203.720 203.660 203.590 203.590 203.590 203.690 
2185.200 185.130 185.070 185.070 185.170 185.170 

Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
No RequiredPTH/NPTHActual Dimension
10.300 YVIAVIAVIAVIA
20.900 Y0.975 0.875 0.090 0.975 
31.000 Y1.000 1.075 1.025 1.000 
41.100 Y1.025 1.100 1.050 1.150 
51.998 N2.025 1.950 1.950 2.000 
62.200 N2.200 2.250 2.250 2.250 
72.400 Y2.450 2.400 2.375 2.375 
83.300 N3.535 3.325 3.325 3.325 

Learn PCB and Buy PCB
Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the glass transition temperature
(Tg), which always is expressed in °C. The most commonly used property is the thermal
expansion. When measuring the expansion versus the temperature, we can get a curve as shown
in following picture. The Tg is determined by the intersection of the tangents of the flat and steep
parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and
glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.
 
For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature
is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily
exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The
expansion of epoxt resin is about 15 to 20 times greater than that of copper when exceeding Tg.
This implies a certain risk of wall cracking in plated-through holes, and the more resin around the
hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between
epoxy and copper is only three times, so here the risk of cracking is negligible.



Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.

The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.

Different plant scale to suit for your requirements

16000 square meter factory building

30000 square meter month capability

8000 types of PCB per month

ISO9001, ISO14001, TS16949, UL Certified

We have our own advantages to help you saving cost and time spent on PCB, booster your new products go to market quickly.

A) Various kinds of PCB products

Double sided PCB

Multilayer PCB up to 32 layers

FR-4 PCB (Tg130, Tg170)

High frequency PCB (RO4350B, RO4003C)

Aluminum PCB (1W/MK, 2W/MK, 3W/MK)

Flexible PCB

HDI PCB Board

B) Multiple PCB technology to meet the market demands

Blind via PCB, Via in pad PCB, Fine pitch BGA PCB

Impedance controlled PCB

Heavy copper PCB

Hybrid material PCB

C) Many discount policies for new customers

SMT stencil foil, free of charge

Prototype shipping cost, free of charge

Prototype test, free of charge

PCB panelization, free of charge

D) High quality PCB services

Engineering design prevents problems from occurring in pre-production.

Meet your PCB needs from prototype to mass volume production.

Eligible products rate of first production: >95%

Delivery on time: >98%, door to door shipment service

Customer complaint rate: <1%

Choose BichengPCB means you choose hassle free.

Send your message to this manufacturer

More >

Other Products with This Manufacturers