| Prod Model: |
BIC-15290-V2 |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy |
| Flame Retardant Properties: |
V0 |
| Application: |
Modem WiFi |
| Processing Technology: |
Enig |
| Base Material: |
Copper Clad Laminate |
| Brand: |
Bicheng |
Product Description
Multilayer PCB High Quality 4 Layer PCB Black PCB 365
Commodity IntroductionThis is a type of 4 layer PCB for the application of Modem WiFi at 1.6mm thick with Immersion gold pad finish. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 panel boards are packed separately.
Parameter & Data Sheet| Number of Layers | 4 |
| Board Type | Multilayer board |
| Board Thickness | 1.6mm +/-0.16 |
| Board Material | FR-4 |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 135ºC |
| |
| PTH Cu thickness | ≥20 um (See hole wall details) |
| Inner Iayer Cu thicknes | 35 um (1oz) |
| Surface Cu thickness | 35 um (1oz) |
| |
| Solder Mask Type and Model No. | LPSM, KSM-S6189BK31 |
| Solder Mask Supplier | KUANGSHUN |
| Solder Mask Colour | Black |
| Number of Solder Masks | 2 |
| Thickness of Solder Mask | 14 um |
| |
| Type of Silkscreen Ink | n/a |
| Supplier of Silkscreen | n/a |
| Color of Silkscreen | n/a |
| Number of Silkscreen | n/a |
| |
| Mininum Trace (mil) | 7.9 mil |
| Minimum Gap(mil) | 5.5 mil |
| |
| Surface Finish | Immersion gold |
| RoHS Required | Yes |
| Warpage | 0.25% |
| |
| Thermal Shock Test | Pass, 288±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Solderablity Test | Pass, 255±5ºC,5 seconds Wetting Area Least 95% |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Microsection Hole Wall (um) | Hole Wall Cu Thickness | ≥20 um | Hole Wall Cu Roughness | ≤25.4 um |
| NO. | A | B | C | D | E | F | AVE |
| 1 | 24.772 | 23.572 | 23.632 | 25.272 | 24.552 | 24.182 | 24.330 |
| 2 | 25.397 | 24.197 | 24.257 | 25.897 | 25.177 | 24.807 | 24.955 |
| 3 | 26.973 | 25.773 | 25.833 | 27.473 | 26.753 | 26.383 | 26.531 |
Outline dimension Unit: mm| NO. | Required Dimension (toerance) | Actual dimension |
| 1 | 194.40 | ±0.15 | 194.46 | 194.45 | 194.41 | 194.30 |
| 2 | 212.00 | ±0.15 | 211.97 | 212.09 | 211.99 | 211.89 |
Hole Size and Slot Dimension (mm)| NO. | Requerment Dimension (tolerance) | PTH/NPT | Actual dimension |
| 1 | 1.500 | ±0.05 | Y | 1.500 | 1.475 | 1.525 | 1.500 |
| 2 | 1.525 | ±0.05 | Y | 1.525 | 1.500 | 1.550 | 1.525 |
PCB Capability More than 14 years of PCB experiencesExcellent after-sales serviceSubstrate material: Epoxy glass (FR-4), High frequency, Metal corePrice advantages on circuit boardsMultilayer PCB and Hybrid material of Multilayer PCBFocus on prototypes, small batches and volume productionTS16949 (2009), ISO14001 (2004), ISO9001 (2008), UL certified| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; 94HB and FR-1 (upon request) |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t<0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--420µm (0.5oz - 12oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger |
Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.
The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.
Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified
We have our own advantages to help you saving cost and time spent on PCB, booster your new products go to market quickly.
A) Various kinds of PCB products
Double sided PCB
Multilayer PCB up to 32 layers
FR-4 PCB (Tg130, Tg170)
High frequency PCB (RO4350B, RO4003C)
Aluminum PCB (1W/MK, 2W/MK, 3W/MK)
Flexible PCB
HDI PCB Board
B) Multiple PCB technology to meet the market demands
Blind via PCB, Via in pad PCB, Fine pitch BGA PCB
Impedance controlled PCB
Heavy copper PCB
Hybrid material PCB
C) Many discount policies for new customers
SMT stencil foil, free of charge
Prototype shipping cost, free of charge
Prototype test, free of charge
PCB panelization, free of charge
D) High quality PCB services
Engineering design prevents problems from occurring in pre-production.
Meet your PCB needs from prototype to mass volume production.
Eligible products rate of first production: >95%
Delivery on time: >98%, door to door shipment service
Customer complaint rate: <1%
Choose BichengPCB means you choose hassle free.
