PCB Board Fr4 Material with Onstatic Blue Soldermask PCB Line
Price: |
US $ 0.61/Piece |
Min Order: |
1/Piece |
Pay Type: |
T/T,Western Union,Paypal |
Prod Model: |
BIC-267-V2.67 |
Finished Thickness: |
1.62 mm |
Pth Cu Thickness: |
25.40um |
Inner Layer Cu Thickness: |
1/1 Oz |
Surface Cu Thickness: |
45.20 Um |
Surface Finish: |
Lead- Free HASL |
Solder Mask: |
Blue,Onstatic,R-500 Bl |
Legend: |
White,Tai Yo,S-380W |
Trace Width (mm): |
0.243mm |
Spacing (mm): |
0. 386mm |
Warp And Twist: |
0.21% |
Type: |
Rigid Circuit Board |
Dielectric: |
FR-4 |
Material: |
Fiberglass Epoxy |
Flame Retardant Properties: |
V0 |
Product Description
Blue HASL prototype PCB Multilayer 4 Layer FR-4 Tg135 V-groove 10up per Panel in Modem
Router
Commodity Introduction
This is a type of FR-4 PCB for the application of Modem Router. It's a 4 layer board at 1.6mm
thick.The base laminate is from ShengYi, Solder mask and silkscreen from ONSTATIC and Taiyo.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are
packed separately.
Parameters & Data SheetItem | Description | Requirement | Actual |
|
Laminate | Laminate Type | FR4:CTI:175V-249V | FR4:CTI:175V-249V |
Supplier | SHENGYI | SHENGYI |
Tg | TG >135 | TG >135 |
Finished thickness | 1.6+/-10% MM | 1.62 MM |
Plating Thickness | PTH Cu thickness | 23 um | 25.40um |
Inner layer Cu Thickness | 1/1 OZ | 1/1 OZ |
Surface Cu thickness | 35 um | 45.20 um |
Solder Mask | Material type | R-500 BL | R-500 BL |
Supplier | ONSTATIC | ONSTATIC |
Color | Blue | Blue |
Single / both sides | Both Sides | Both Sides |
S/M thickness | >= 10.0 um | 28.80 um |
3M tape test | NO Peel Off | no peel off |
Legend | Material type | S-380W | S-380w |
Supplier | Tai yo | Tai yo |
Color | White | White |
Location | Both Sides | Both Sides |
3M tape test | No peel off | no peel off |
Circuit | Trace Width (mm) | 0.25mm | 0.243mm |
Spacing (mm) | 0.38mm | 0. 386mm |
Identification | UL mark | 94V0 | 94V0 |
Company Logo | YES | OK |
Date code | 1117 | 1117 |
Mark location | CS | CS |
Surface Finish | Lead- free HASL | 1-40 um | 5.3 um |
Reliabilty Tests | Thermal shock test | 288±5ºC,10sec, 3 cycles | NO Discolor, NO Delamination |
solder abllity test | 235±5ºC | 100% Wetting |
Function | Electrioal Test | 100% | pass |
Standard | IPC-A 600H class 2, IPC_6012C CLASS 2 | 100% | Pass |
Appearance | Visual inspection | 100% | Pass |
warp and twist | <= 0.75% | 0.21% |
Others | V-Cut thickness | 0.4±0.1 mm | 0.39mm |
Angle | 30+/- 5 | 30º |
Finished dimension (unit: mm): including v-cutNo | Required | Actual Dimension |
1 | 69.99 | 69.96 | 69.92 | 69.96 | 69.96 | 69.92 |
2 | 99.06 | 99.03 | 98.99 | 99.03 | 99.03 | 98.99 |
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)No | Required | PTH/NPTH | Actual Dimension |
1 | 0.356 | Y | VIA | VIA | VIA | VIA |
2 | 0.650 | N | 0.700 | 0.650 | 0.650 | 0.700 |
3 | 0.889 | Y | 0.850 | 0.950 | 0.875 | 0.950 |
4 | 0.965 | Y | 0.900 | 1.000 | 1.025 | 1.025 |
5 | 1.016 | Y | 1.025 | 0.950 | 1.050 | 1.075 |
6 | 1.321 | Y | 1.375 | 1.250 | 1.325 | 1.375 |
7 | 1.575 | Y | 1.650 | 1.575 | 1.550 | 1.055 |
8 | 2.000 | N | 2.050 | 2.000 | 2.025 | 2.050 |
9 | 3.175 | Y | 3.100 | 3.125 | 3.150 | 3.150 |
10 | 3.327 | N | 3.300 | 3.335 | 3.400 | 3.375 |
Learn PCB and Buy PCB
Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the glass transition temperature
(Tg), which always is expressed in °C. The most commonly used property is the thermal
expansion. When measuring the expansion versus the temperature, we can get a curve as shown
in following picture. The Tg is determined by the intersection of the tangents of the flat and steep
parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and
glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.
For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature
is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily
exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The
expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg.
This implies a certain risk of wall cracking in plated-through holes, and the more resin around the
hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between
epoxy and copper is only three times, so here the risk of cracking is negligible.

Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.
The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.
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A) Various kinds of PCB products
Double sided PCB
Multilayer PCB up to 32 layers
FR-4 PCB (Tg130, Tg170)
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