Bicheng Enterprise Limited >> RO4350b 4 Mil (0.1mm) 14 Layer PCB Circuit Board BGA

RO4350b 4 Mil (0.1mm) 14 Layer PCB Circuit Board BGA

RO4350b 4 Mil (0.1mm) 14 Layer PCB Circuit Board BGA
Price: US $ 1.04/Piece
Min Order: 1/Piece
Pay Type: T/T,Western Union,Paypal
Prod Model: BIC-662-V6.62
Board Thick: 1.6mm
Surface Finish: Immersion Gold
Out Layer Copper: 35 Um (1 Oz)
Soldermask Color: Green
Silkscreen Color: White
Minimum Trace And Space: 4 Mil/4 Mil
Minimum / Maximum Holes: 0.35/3.5mm
Final Foil Internal: 1 Oz
Via: Plated Through Hole(Pth)
Test: 100% Electrical Test
Type: Rigid Circuit Board
Dielectric: FR-4
Material: Fiberglass Epoxy
Flame Retardant Properties: V0

Product Description

Company Profile
You're benefit from following 5 types of 2 layer PCB's from Bicheng Enterprise Limited.

(1) FR-4 material (The most common used today)

Normal TG, High TG 170, High CTI 600V
Material (CCL) Brand: ITEQ, SHENGYI, KB

(2) High frequency material

RO4350B, RO4003C
PTFE (F4B series from China Brand)

(3) Insulated Metal Substrate (IMS) PCB, typical stack-up as follows

L1---Copper conductor
PP---dielectric material
L2---copper conductor
PP---dielectric material
AL---aluminum base

(4) Metal core PCB (MCPCB), typical stack-up as follows

L1---copper conductor
PP---dielectric material
AL---aluminum core
PP---dielectric material
L2---copper conductor

(5)Polyimide material (Flexible PCB)


Printed Circuit Board


Aluminum PCB


High Frequency PCB


Flex PCB


Technology Information

ITEQ  Laminate/ Prepreg : IT-180ATC / IT-180ABS
IPC-4101C Spec / 99 / 101 / 126
LAMINATE( IT-180ATC)
PropertyThickness<0.50 mmThickness>=0.50 mmUnitsTest 
Method
            [0.0197 in]             [0.0197 in]
Typical 
Value
SpecTypical 
Value
SpecMetricIPC-
TM-650
(English)(or as 
noted)
Peel Strength, 
minimum
    N/mm2.4.8
A. Low profile
 copper foil and 
very low profile 
copper foil - all 
copper weights 
> 17
mm [0.669 
mil] 
    (lb/inch)2.4.8.2
B.Standard 
profile 
copper foil
0.88 (5.0)0.70 (4.00)0.88 (5.0)0.70 (4.00) 2.4.8.3
1. After Thermal 
Stress
      
2. At 125°C 
[257 F]
      
3. After Process 
Solutions
1.23 (7.0)0.80 (4.57)1.40 (8.0)1.05 (6.00)  
 1.05 (6.0)0.70 (4.00)1.23 (7.0)0.70 (4.00)  
 1.05 (6.0)0.55 (3.14)1.23 (7.0)0.80 (4.57)  
Volume 
Resistivity, 
minimum
    MW-cm2.5.17.1
A. C-96/35/903.0x1010106----
B. After moisture 
resistance
----3.0x1010104
C. At elevated 
temperature E-
24/125
5.0x10101031.0x1010103
Surface 
Resistivity, 
minimum
    MW2.5.17.1
A. C-96/35/903.0x1010104----
B. After moisture 
resistance
---- 3.0x1010104
C. At elevated 
temperature E-
24/125
4.0x1010103 4.0x1010103
Moisture 
Absorption, 
maximum
----0.120.8%2.6.2.1
Dielectric 
Breakdown, 
minimum
----6040kV2.5.6
Permittivity (Dk, 
50% resin 
content)
 5.4 5.4-- 
 (Laminate & 
Laminated 
Prepreg)
   
A. 1MHz4.44.42.5.5.9
B. 1GHz4.44.4 
C. 2GHz4.24.32.5.5.13
D. 5GHz4.14.1 
E. 10GHz44.1 
Loss Tangent 
(Df, 50% resin 
content)
 0.035 0.035-- 
 (Laminate & 
Laminated 
Prepreg)
   
A. 1MHz0.0150.0142.5.5.9
B. 1GHz0.0150.015 
C. 2GHz0.0150.0152.5.5.13
D. 5GHz0.0160.016 
E. 10GHz0.0170.016 
Flexural 
Strength, 
minimum
    N/mm22.4.4
A. Length 
direction
----500-530 415(lb/in2)
 ----(72,500-76,850)-60,190 
B. Cross 
direction
----410-440 345 
 ----(59,450-63,800)-50,140 
Arc Resistance,
 minimum
1256012560s2.5.1
Thermal Stress 
10 s at 288°C 
[550.4F],
minimum
    Rating2.4.13.1
A. UnetchedPassPass 
Visual
PassPass 
Visual
B. EtchedPassPass 
Visual
PassPass 
Visual
Electric 
Strength, 
minimum
4530----kV/mm2.5.6.2
 (Laminate & 
Laminated 
Prepreg)
Flammability, V-0V-0V-0V-0RatingUL94
  (Laminate & 
Laminated 
Prepreg)
Glass Transition 
Temperature
(DSC)
175170 
minimum
175170 
minimum
˚C2.4.25
Decomposition 
Temperature
----345340 
minimum 
˚C2.4.24.6
(5% wt
 loss)
X/Y Axis CTE 
(40
ºC to 125ºC)
----10--13--PPM/˚C2.4.24
Z-Axis CTE      2.4.24
 A.  Alpha 1----4560 
maximum
PPM/˚C
 B.  Alpha 2----210300 
maximum
PPM/˚C
 C.  50 to 
260 Degrees 
C
----2.73.0 
maximum
%
Thermal 
Resistance
     2.4.24.1
A.  T260 ---->6030 
minimum
Minutes
B.  T288 ---->3015 
minimum
Minutes
CAF 
Resistance
----PassAABUSPass/Fail2.6.25

Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.

The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.

Different plant scale to suit for your requirements

16000 square meter factory building

30000 square meter month capability

8000 types of PCB per month

ISO9001, ISO14001, TS16949, UL Certified

We have our own advantages to help you saving cost and time spent on PCB, booster your new products go to market quickly.

A) Various kinds of PCB products

Double sided PCB

Multilayer PCB up to 32 layers

FR-4 PCB (Tg130, Tg170)

High frequency PCB (RO4350B, RO4003C)

Aluminum PCB (1W/MK, 2W/MK, 3W/MK)

Flexible PCB

HDI PCB Board

B) Multiple PCB technology to meet the market demands

Blind via PCB, Via in pad PCB, Fine pitch BGA PCB

Impedance controlled PCB

Heavy copper PCB

Hybrid material PCB

C) Many discount policies for new customers

SMT stencil foil, free of charge

Prototype shipping cost, free of charge

Prototype test, free of charge

PCB panelization, free of charge

D) High quality PCB services

Engineering design prevents problems from occurring in pre-production.

Meet your PCB needs from prototype to mass volume production.

Eligible products rate of first production: >95%

Delivery on time: >98%, door to door shipment service

Customer complaint rate: <1%

Choose BichengPCB means you choose hassle free.

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