Via Tented Circuit Board 4 Layer Immersion Gold PCB
| Price: |
US $ 0.61/Piece |
| Min Order: |
1/Piece |
| Pay Type: |
T/T,Western Union,Paypal |
| Prod Model: |
BIC-401-V4.01 |
| Board Thick: |
1.6mm |
| Surface Finish: |
Immersion Gold |
| Out Layer Copper: |
35 Um (1 Oz) |
| Soldermask Color: |
Blue |
| Silkscreen Color: |
No |
| Inner Copper Thick: |
18 Um(0.5 Oz) |
| Test: |
100% Electrical Test |
| RoHS Required: |
Yes |
| Type: |
Rigid Circuit Board |
| Dielectric: |
FR-4 |
| Material: |
Fiberglass Epoxy |
| Flame Retardant Properties: |
V0 |
Product Description
Blue soldermask Multilayer PCB 4 Layer with Immersion Gold
Commodity Introduction
This is a type of FR-4 PCB for the application of Wireless Adapter. It's a 4 layer board at 1.6mm
thick. The base laminate is from ITEQ, Solder mask and silkscreen from KUANG SHUN. It's
fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are
packed separately.
Main parameters
1)Multilayer 4 layer PCB
2)FR-4 laminate Tg170ºC, ITEQ brand
3)Finished PCB thickness at 1.6mm +/-0.16mm (1.57-1.64mm)
4)Inner layer copper weight 18um (0.5oz), Out layer copper weight 35um (1oz)
5)Matt blue solder mask on top and bottom, type KSM-S6189BLM1, via tented, liqu
6)PCB shipped in panel size 94.75mm x 176mm =10up
7)4 layer layup
Fab drawimg
Design For Manufacture| Serial NO. | Procedure | Item | Manufacturing capability |
Large
volume
(S<100 m²) | Middle
volume
(S<10 m²) | Prototype
(S<1m²) |
|
| 1 | Inner layer
(18um, 35um,
70um etc are
finished copper.
If not mentioned
copper, finished
1oz is the
default value ) | Min.isolation
of layers | 0.1mm | 0.1mm | 0.06mm |
| 2 | Min.track and
spacing | 5/5mil
(18um) | 4/4mil
(18um) | 3/3.5mil
(18um) |
| 3 | 5/5mil
(35um) | 4/4mil
(35um) | 3/4mil
(35um) |
| 4 | 7/9mil
(70um) | 6/8mil
(70um) | 6/7mil
(70um) |
| 5 | 9/11mil
(105um) | 8/10mil
(105um) | 8/9mil
(105um) |
| 6 | 13/13mil
(140um) | 12/12mil
(140um) | 12/11mil
(140um) |
| 7 | Min.distance
from drill
to conductor | 4 Layer
10mil,
6 layer
10mil,
8-12 layer
12mil | 4 layer 8mil,
6 layer 8mil,
8-12 layer
10mil,
14-20 layer
14mil,
22-32 layer
18mil | 4 layer 6mil,
6 layer 6mil,
8-14 layer
8mil,
16-22 layer
12mil,
24-32
layer
14mil |
| 8 | Min.width of
annular ring
on inner layer | 4 Layer
10mil
(35um),
≥6 Layer
14mil(35um) | 4 Layer
8mil(35um),
≥6 layer
12mil(35um) | 4 Layer 6mil
(35um),≥6
Layer 10mil
(35um) |
| 9 | Inner layer
isolation ring
width(Min) | 10mil
(35um) | 8mil (35um) | 6mil (35um) |
| 10 | Min.via pad
diameter | 20mil
(35um) | 16mil
(35um) | 16mil
(35um) |
| 11 | Min. distance
from board
edge to
conductor
(no copper
exposured)
(inner layer) | 14 mil
(35um) | 12 mil
(35um)) | 8 mil(35um) |
| 12 | Maximum
copper
weight(Inner
layer and
outer layer) | 3 OZ
( 105 um ) | 4 OZ
(140 um ) | 6 OZ
(210um ) |
| 13 | Core with
different
copper foil
on both
sides | / | 18/35,
35/70 um | 18/35,
35/70 um |
Learn and Buy PCB----ENIG
ENIG stands for Electroless nickel immersion gold which is a type of surface plating used for
circuit boards. It consists of an electroless nickel plating covered with a thin layer of immersion
gold. Normally, the thickness of nickel is 120µ" - 200µ" (3µm to 5µm ) and gold 1-5µ" (0.025µm-
0.127µm).
ENIG has several advantages than HASL, including
a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP
mounted components to reduce failure rate during assembly and soldering.
b) Good oxidation resistance and good heat dissipation.
c) Long storage time (It can be stored for more than 1 year in vacuum bag)
d) High solderability, no stressing of circuit boards and less contamination of PCB surface.
e) SMT process is resistant to reflow soldering, resistant to rework.
Founded in 2003, Bicheng Enterprise Limited is a professional PCB export enterprise. We have established a good relationship of cooperation with well-known enterprises in the same industry.
The factories have been ISO 9001-2008, ISO 14001-2004 and ISO/TS16949-2009 quality management system certified. Over the past 14 years, we have provided professional circuit board manufacturing solutions for more than 5000 companies worldwide.
Different plant scale to suit for your requirements
16000 square meter factory building
30000 square meter month capability
8000 types of PCB per month
ISO9001, ISO14001, TS16949, UL Certified
We have our own advantages to help you saving cost and time spent on PCB, booster your new products go to market quickly.
A) Various kinds of PCB products
Double sided PCB
Multilayer PCB up to 32 layers
FR-4 PCB (Tg130, Tg170)
High frequency PCB (RO4350B, RO4003C)
Aluminum PCB (1W/MK, 2W/MK, 3W/MK)
Flexible PCB
HDI PCB Board
B) Multiple PCB technology to meet the market demands
Blind via PCB, Via in pad PCB, Fine pitch BGA PCB
Impedance controlled PCB
Heavy copper PCB
Hybrid material PCB
C) Many discount policies for new customers
SMT stencil foil, free of charge
Prototype shipping cost, free of charge
Prototype test, free of charge
PCB panelization, free of charge
D) High quality PCB services
Engineering design prevents problems from occurring in pre-production.
Meet your PCB needs from prototype to mass volume production.
Eligible products rate of first production: >95%
Delivery on time: >98%, door to door shipment service
Customer complaint rate: <1%
Choose BichengPCB means you choose hassle free.
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